JPS6223463B2 - - Google Patents
Info
- Publication number
- JPS6223463B2 JPS6223463B2 JP13424578A JP13424578A JPS6223463B2 JP S6223463 B2 JPS6223463 B2 JP S6223463B2 JP 13424578 A JP13424578 A JP 13424578A JP 13424578 A JP13424578 A JP 13424578A JP S6223463 B2 JPS6223463 B2 JP S6223463B2
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- cooling plate
- lid
- electrode
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 40
- 238000001816 cooling Methods 0.000 claims description 28
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 239000008188 pellet Substances 0.000 description 20
- 238000010586 diagram Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000012856 packing Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13424578A JPS5561047A (en) | 1978-10-31 | 1978-10-31 | Semiconductor device for electric power |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13424578A JPS5561047A (en) | 1978-10-31 | 1978-10-31 | Semiconductor device for electric power |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5561047A JPS5561047A (en) | 1980-05-08 |
| JPS6223463B2 true JPS6223463B2 (en]) | 1987-05-22 |
Family
ID=15123782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13424578A Granted JPS5561047A (en) | 1978-10-31 | 1978-10-31 | Semiconductor device for electric power |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5561047A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6181006B1 (en) * | 1998-05-28 | 2001-01-30 | Ericsson Inc. | Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink |
-
1978
- 1978-10-31 JP JP13424578A patent/JPS5561047A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5561047A (en) | 1980-05-08 |
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